In 2007, China's semiconductor lighting industry developed steadily. The development of epitaxial chip companies was particularly rapid, the scale of packaging enterprises continued to grow rapidly, and lighting applications made great progress. At the same time of rapid industrial growth, the domestic industrial structure has also been greatly improved, and the share of mid-to-high-end products has gradually increased. For example, display chips, SMD and high-power packaging products, street lamps and other lighting products have made significant progress.
As of December 2007, there are more than 80 MOCVDs in China, including more than 50 production GaN MOCVDs and about 10 production MOCVDs, and other research equipments for domestic research institutes. According to the investment plans of various manufacturers, more than 40 MOCVDs are expected to be added in 2008, and the scale of epitaxial chip production capacity in China will be greatly improved.
In 2007, China's chip production value reached 1.5 billion yuan, an increase of 43% compared with 1.05 billion yuan in 2006. The domestic GaN chip output value was 800 million yuan, an increase of 78% from the 450 million yuan in 2006. In 2007, the increase in production capacity of domestic GaN chips was also very prominent, with a 60% increase from 2006 to 960 kk/month. The actual annual output reached 9 billion, and the national productivity also increased to 35%. The most important thing is that the performance of domestic chips has improved rapidly. It has been recognized in high-end applications such as display screens, signal lights, outdoor lighting, and small and medium-sized backlights. The market structure has been significantly improved. It is expected that the average growth rate of domestic chip production capacity will be over 30% in the next few years.
In 2007, the output value of China's LED packaging reached 16.8 billion yuan, up 15% from the 14.8 billion yuan in 2006; the output increased by 24% from 66 billion in 2006 to 82 billion, of which the output value of high-brightness LED reached 12 billion yuan. Accounting for 71% of total LED sales. At the same time, from the perspective of product and enterprise structure, domestic improvement has also been made. SMD and high-power LED packaging have grown rapidly. At present, the national high-power packaging capacity has reached 10 KK/month.
Domestic LED output, chip production and chip country yield in 2007
Type LED production
(100 million)
Chip yield
(100 million)
Chip country yield
( % )
Quaternary LED
300
120
40
GaN LED
260
90
35
Puliang LED
260
170
64
total
820
380
46
China's LED packaging market size and growth rate changes
China's LED package production changes
In 2007, the output value of China's applied products has exceeded 30 billion yuan. It has become the world's largest producer and exporter of LED full-color display, solar LED, landscape lighting and other applications. The emerging semiconductor lighting industry is taking shape. Domestically, it has formed certain characteristics in the field of lighting. Among them, outdoor lighting has the fastest development. There are hundreds of LED street lamp companies and dozens of demonstration roads have been built. However, domestic large-size LCD backlights and automobile headlights still lag behind.
At present, the domestic research level is 90lm/W for low-power chips and 70 lm/W for power chips. The industrialization level of power chips reaches 60lm/W, which is closer to the level of international industrialization. A group of technologies with independent intellectual property rights have been mastered in substrate preparation, epitaxial growth, and chip technology. The power type white light package has made important research progress in packaging structure design, heat dissipation, lens, phosphor coating, etc., and the light efficiency of the foreign chip package can reach 70-80lm/W, reaching the international industrialization level. However, domestic stable, batch, and especially high-quality production technologies need to be further improved.
Comparison of technical indicators of power type white LEDs at home and abroad (December 2007)
Classification luminous efficiency (lm/W) @350mA
Color rendering index
Current domestic industry level
60 to 68
>80
Domestic industry level at the end of the fifteenth
30~40
>70
South Korea, Taiwan, China
60～70
>80
Beauty, Japan, Europe
70～80
>80
It is worth noting that the disputes over the core patents of international semiconductor lighting began to directly affect domestic enterprises. The relevant research institutions in the United States recently applied for the 337 investigation and began to use the patent manufacturing trade barriers, which have directly involved six Chinese enterprises. This shows that the situation of domestic enterprises outside the international patent dispute has changed, and domestic related enterprises should adjust the patent strategy as soon as possible.
In 2007, the investment in the domestic semiconductor lighting industry increased rapidly. The investment from the upstream and downstream epitaxial chips, downstream packaging applications to related materials and auxiliary industries has greatly increased. According to incomplete statistics, in 2007, the domestic semiconductor lighting industry's new investment was nearly 4 billion yuan, while the planned investment exceeded 15 billion. At the same time, corporate financing channels are showing a diversified trend. The introduction of strategic investment, venture capital, overseas listing, backdoor listing, mergers and acquisitions and other capital operation methods will surely bring about new changes in China's industrial structure.
In 2008, white LEDs were the most popular LED driver for portable devices. The latest LED drivers only need 5 external components. Taiwan's LED backlight business opportunities can increase by more than 60%. China's LED lighting application market has matured 9 to be developed.
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