LED industry adds new army
Following the announcement of TSMC's step-by-step LED manufacturing process, the packaging and testing company's silicon products precision also actively cut into LED packaging technology. Silicon Precision said that it is difficult to lock in the high-brightness LED multi-chip packaging market with high technical difficulty. With rich experience in wire packaging, it is confident that its yield is better than other competitors. Currently, the wire-type LED package has been shipped to 3 US companies. We are customers and develop wafer-level LED packaging technology, which is expected to be mass-produced in 2011. With the addition of TSMC and Silicon Products 2, the impact on the existing LED industry is not small.
Since most countries have increased their investment in LEDs, such as 50% of the cost of subsidized indoor lighting in Japan, China has invested RMB 5 trillion in investment plans for wind power, solar energy and LEDs from 2010 to 2020. As for other developing countries, Since 2012, mercury-containing lamps will no longer be used, and LED lamps will be used. It is expected that LED lighting lamps will flourish and the LED industry will continue to grow in the next 10 years.
As the market continues to expand, high-brightness LED modules account for 3D silicon-silicon perforated (TSV) package output value will jump to $102 million in 2015 (YoleDeveloppement forecast), the growth rate is significant, silicon products focus on this, recently Introducing LED packaging technology and emphasizing that in the future, under the highly integrated 3DIC technology, LED will play a very important role.
Silicon products pointed out that the company has been developing LED packaging technology for one year, which is mainly for the multi-LED chip packaging field with high technical difficulty. It is different from the one-chip package of light and crystal. Way? Han~ With the rich experience in IC packaging technology in the past, I believe that the yield will be higher than that of the peers. At present, three US customers have entered mass production. The products are applied to 25W high-brightness LED lighting, and several customers. In the sample delivery stage, it is expected to produce in volume in 2011.
Silicon products frankly, the LED package gross margin is not high, but with the more difficult multi-chip packaging technology, the profit is still better than the single-chip package, the current customer orders for the chip is 25 LED chips, has been successfully supplied, looking forward to the future silicon The product uses a wire-type LED package as a stepping stone to move toward wafer-level LED packaging. As wafer-level packaging equipment is still immature, the company is in the research and development stage and is expected to officially enter the market in 2011. As with the wire package, as long as the number of chips is larger, the wafer-level packaging efficiency is higher.
Looking at the semiconductor industry, including Lingsheng and Fukuoka, all involved in the LED industry, but the business model is different from silicon. Nowadays, the development direction of TSMC is similar to that of silicon, but the model is still different. Silicon products focus on the packaging technology model. TSMC cuts into the rear section of the LED, from light source processing, electric drive to thermal module, all integrated on the silicon wafer to provide the components needed for the lighting product.
TSMC has standardized and mass production advantages in silicon wafer substrates. In addition, its investment in mining and finishing materials has been successfully integrated into LED high-power solid-state lighting packaging in 2009, and will play a vertical integration effect with TSMC. With the addition of TSMC and Silicon 2, it will affect existing LEDs.
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