The development of microelectronics Modern electronic manufacturing and SMT (Surface Mount Technology) are inextricably linked. The manufacture of any mobile phone or any computer is inseparable from SMT. As a matter of fact, the global SMT-based production line in the electronics manufacturing industry is shifting to China on a large scale. The demand for core equipment placement machines in China has accounted for about 50% of global demand. In the trend of miniaturization of PCBs and IC components, 0201 or even smaller components such as 01005 and CSP, BGA, and fine pitch devices have already been used in actual production in China, which inevitably requires advanced electronic manufacturing equipment and new products. Materials need to enter the Chinese market synchronously with the world.
The Siemens Logistics and Assembly Systems Division has synchronized its latest MicrobeamTM and modular SIPLACE systems globally into China. Tilo Brandis, chairman of the Siemens Logistics and Assembly Electronics Assembly Systems Division, said that China will one day become our production base because it is not only China’s huge market demand that attracts us. China’s high-quality engineers are also what we in Germany need, but we will never We will not reduce the quality of our products by relocating our production bases. According to Tilo Brandis, the company has established a world-leading electronic manufacturing demonstration factory in Shenzhen to demonstrate to the industry the optimization of its SIPLACE complete solution.
Assembleon also believes that China is not only a low-cost manufacturing base, but also one of the key drivers of the global market and technology. According to Corinthian CEO Cor Scholten, in the mobile phone market, color screens and photo-taking have actually become the standard configuration of the Chinese market, but this is not the case in other countries. All of these put forward higher requirements for SMT process technology and equipment. For this purpose, Assembleon has planned to transfer the manufacturing of some of its AX series modular mounters to China. Global Instruments, one step ahead, claimed that by the end of 2005, 50% of Global Instruments's placement machines were produced in China, and that 100% of local manufacturing was based on the current 70% local matching rate.
In 2004, the world’s most advanced manufacturing equipment for the growth of China’s three largest electronics manufacturers entered China, objectively indicating that Chinese electronics manufacturers are producing advanced products. Lule, president of NEC Communications (China) Co., Ltd., stated at the 3G mobile phone development forum held in Shenzhen in October 2004 that “it is not enough to have a single advantage in the upcoming 3G market in China. NEC’s 3G business focuses on China. In addition to the supply of the Japanese market, all NEC's 3G handsets are manufactured in China, and 1/3 to 2/3 of the technology R&D will be moved to China.â€
Su Mingcun, general manager of Shanghai and North China operations of Flextronics, an SMT equipment purchaser, repeatedly emphasized that Flextronics has extended the traditional EMS service in China and has provided customers with end-to-end service capabilities, including innovative product design. , test programs, production, IT expertise, and logistics, logistics, warranty services, etc.
The momentum of in-depth development of China's domestic electronics suppliers to the industry is even more encouraging. Changhong, which has succeeded in the success of China's color TV industry in occupying the domestic market, has not only produced large-scale digital devices, but has also been adopted by international companies such as Toshiba, NEC, Samsung, and LG. There are 20 wholly owned and controlled electronics companies under the Daxian Group, but 50% of them are supporting companies. After the Founder Group acquired Zhuhai multilayer circuit board company in September 2003, it is currently preparing to further infiltrate into the chip manufacturing industry through joint ventures.
At the International Electronic Products and Parts Sourcing Fair held in Shanghai in April 2004, Hamilton Shack, vice president of global procurement for Radio Shack, the largest mobile phone seller in the United States, stated: “At present, if a company does not purchase products from China, it is fundamental. Can not meet the needs of consumers." It is reported that Radio Shack's goal is to hope that in 2004 China's purchases accounted for 75% of its global purchases. It can be seen that the products of China's electronics manufacturers are completely recognized by the world's demand markets, and they are not only cheap but also beautiful.
The miniaturization of production and the lead-free production of products have become opportunities for China's electronics manufacturing technology advancement in multilayer boards, flexible boards, and high-density interconnect (HDI/BUM) substrates and IC packaging board substrates (BGA, CSP). Today is becoming a mainstream demand, 76% of China's electronics manufacturing army is the reality of foreigners. Is there any reason to despise China's electronics manufacturing? Sammy Yi, deputy director of the SMTA International Committee, said in the first half of 2004: “In China, companies engaged in direct electronic manufacturing, or suppliers of materials and equipment, are still using traditional low-tech and low-cost technologies to locate companies in China. I am afraid that the direction of development will not be able to keep up with the situation."
The development and progress of microelectronics technology is mainly based on the continuous improvement of process technology, which makes the feature size of devices continue to shrink, resulting in continuous increase in the degree of integration, reduced power consumption, and improved device performance. In the 21st century, microelectronics technology will continue to be dominated by silicon-based CMOS process technology, which is continuously shrinking in size. Although microelectronics has made great progress in the research of compound semiconductors and other new materials and its application in some fields, it is still far from the conditions for replacing silicon-based processes. With the development of silicon integrated circuit technology, trillions of dollars in equipment and technology investment worldwide have enabled silicon-based processes to form very strong industrial capabilities. At the same time, long-term research investment has enabled people to understand the various properties of silicon and its derivatives to a very deep, very thorough and become the most natural elements of more than 100 kinds, which is a very valuable accumulation of knowledge.
The main development aspects of silicon-based microelectronics technology are threefold:
First, continue to reduce the feature size of the device The so-called feature size refers to the minimum line width in the device for MOS devices, usually refers to the device GeGe determined by the communication geometry, is a processing line in the smallest size can be processed, but also in the design The minimum design size unit (design rule) used is often used as a sign of technical level.
Based on market competition, continuously improving product performance/price ratio is the driving force for the development of microelectronics technology. Reducing feature size to increase integration is one of the most effective means of improving product performance/price ratio. Only the feature size is reduced. Under the same integration level, the chip area can be made smaller, and the wafer output of the same diameter can be improved. Of course, adding the diameter of the silicon wafer can also increase the output, and the increase in integration can not only increase the output, but also increase the speed and reliability of the product, and accordingly the cost can be reduced.
Based on the above reasons, under the impetus of new technology, integrated circuits have increased their integrated level by 4 times every three years since the invention of the integrated circuit in the 40 years since its invention, while the processing feature size has been reduced by 2 times. This is Gordon E, one of the founders of Intel Corporation. The law that Dr. Moore summed up in 1965 was called Moore's Law.
Integrated circuit technology is the fastest-growing technology in the last 50 years, and the design rules for the most important feature parameters of integrated circuits have shrunk by 140 times in 40 years from 1959. The average transistor price is reduced by 107 times.
Table 2 shows the characteristics of semiconductor technology processing dimensions observed by organizations such as STA in the United States in 1999 and the development milestones of the corresponding representative products. According to its forecast, 4G DRAM will begin to enter production in 2003. Its degree of integration reaches 4 billion components, which is equivalent to the volume of newspapers (19,000 pages) that can be stored for one and a half years or 47 minutes of animation or 6 hours of speech.
The wafer diameter of large-scale production is mainly 200mm, but 300mm-diameter silicon wafers began to appear around 2000. 20 Around the year of 15 or so there may be 400-450mm diameter silicon wafers.
However, it should be pointed out that the development history and technological progress pointed out by this odometer do not mean that one generation will be eliminated. On the contrary, the actual industry distribution tends to coexist for several generations, occupying the relevant application fields with the lowest cost and the largest income/input ratio.
As device feature sizes shrink, we face two levels of problems: the level of key technology development and the level of basic research.
1. The key technology development level has now entered large-scale production at 0.25 micron and 0.18 micron. The 0.15-micron and 0.13-micron large-scale production technologies have also been developed and have the conditions for large-scale production. Of course there are still a lot of development and research work to be done, such as the development of IP modules, the development of device models for EDA services, and product development based on the above-mentioned processing technologies. However, in the 0.13 micron - 0.07 micron phase, the most critical processing technology - exposure technology is still a big problem, has not yet been resolved. We know that the reason why the device feature size can be reduced is mainly due to the progress of exposure technology. As can be seen from the figure, there is a "gap" to be developed around 0.1 microns. Whoever can make a breakthrough in this "gap" will have an advantage in the development of the IC industry five years later. Also below 65nm is using E? V (Extra? V) is still using electron beam stepper or other methods, are still under study.
In another key technology - interconnect technology, copper interconnects have been used in the 0.25--0.18 micron technology generation, but after 0.13 micron, the reliability of copper interconnects and low dielectric constant insulation materials used together Still to be studied. Similarly, anyone who can make a breakthrough can seize the initiative.
2. The basic research level is mainly after 0.07 micrometers, especially for new devices with spatial dimensions on the order of nanometers (10-9m) and time scales of femtosecond (1015s), which will encounter device structures, key processes, and integration technologies. A series of problems in heat dissipation problems, material systems, and theoretical foundations. Specific areas that require innovation and focus development include transport theory, device models, thermal barrier models, simulation and simulation software for sub 50 nm semiconductor devices based on mesoscopic and quantum physics, novel device structures, and high-K gate dielectric materials. New gate structures, electron beam step lithography and 13nm EUV lithography, ultra-fine line etch, low-k dielectrics and Cu interconnects, integration technologies, and thermal technologies.
Second, the system integration chip (SOC) is the focus of development;
At the beginning of the development of integrated circuits (ICs), circuits began with the physical layout of the device, and later appeared the Cell-Lib, using IC design from the device level to the logic level. This design idea makes a large number of circuits and Logic designers can directly participate in IC design, which greatly promotes the development of the IC industry. However, the IC is not the final product. It can only be used if it is loaded into a complete system. The IC realizes the entire system by means of printed circuit board (PCB) technology. Although the speed of ICs can be very high and the power consumption can be very small, the performance of the entire system is greatly limited due to the delay of the connection between the ICs in the PCB board, the reliability of the PCB board, and the weight limitations. With the development of high-speed, low-power, low-voltage and multi-media, network, and mobile systems, the requirements of the system for the circuit are getting higher and higher, and the traditional IC design technology can no longer meet the requirements of the entire system with increasingly higher performance. . At the same time, as the level of IC design and process technology continues to increase, the scale of integrated circuits is getting larger and larger, and the complexity is getting higher and higher, and the entire system can already be integrated into one chip. Currently, 108-109 transistors can be integrated on one chip, and with the development of integrated circuit manufacturing technology, the 21st century microelectronic technology will gradually develop from the current 3G (G=109) era to 3T (T=1012). In the era, the storage capacity developed from G-bit to T-bit, the speed of IC devices evolved from GHz to THz, and the data transmission rate ranged from Gbps to Tbps.
It is in the dual role of demand pulling and technology promotion that the system-on-chip (SOC) concept in which the entire system is integrated on an IC chip has emerged.
The design principles of SOC and IC are different. It is a revolution in the field of microelectronics design.
From the perspective of the entire system, the SOC integrates processing mechanisms, model algorithms, software (especially the operating system on the chip - embedded operating systems), chip architecture, and the design of circuits at each level up to the device, in a single chip. Complete the function of the entire system. Its design must start from the system behavior level Top-Down. Many studies have shown that compared with systems composed of ICs, SOC designs can comprehensively and comprehensively consider various situations of the entire system, and can achieve higher-performance system metrics under the same technological conditions.
SOC mainly has three key support technologies: 1Software and hardware collaborative design technology. Functional Partition Theory for Software and Hardware for Different Systems. The closer integration of hardware and software is not only an important feature of SOC, but also a major trend in the development of IT industry in the 21st century. 2IP module library problem. There are three types of IP modules, namely soft cores, which are mainly functional descriptions; solid cores, which are mainly structural designs; and hard cores, process-based physical designs, process-related, and process-proven. Among them, the use of hard cores has the highest value. CMOS CPUs, DRAMs, SRAMs, E2PROMs, and flash memory, as well as A/D, D/A, etc., can all become hard cores, especially based on deep sub-micron device models and circuit simulations, on speed and power consumption. The modules that are optimized and have the greatest process tolerance are most valuable. 3 comprehensive analysis technology between module interfaces. This mainly includes the glue logic tec hnologies between IP modules and the comprehensive analysis and implementation technology of IP modules.
The transformation of microelectronics technology from IC to SOC is not only a conceptual breakthrough, but also an inevitable result of the development of information technology. Through the above three support technology innovations, it will inevitably lead to another information technology revolution featuring system chips. . At present, SOC technology has emerged, and the 21st century will be a period of rapid development of SOC technology.
Third, the combination of microelectronics and other disciplines gave birth to new technologies and industrial growth point The strong vitality of microelectronics technology is that it can produce microelectronic structural modules with high reliability and high precision in low cost and in large quantities. Once this technology is combined with other disciplines, it will create a series of new disciplines and major economic growth points. As a typical example of successful integration with microelectronics technologies, MEMS (micro-electro-mechanical system or micro-electromechanical system) technology and bio-chips are included. The former is a combination of microelectronics technology and machinery, optics and other fields, the latter is a product of bioengineering technology.
1. MEMS technology The microelectronic mechanical system is a broadening and extension of microelectronics technology. It integrates microelectronics technology and precision machining technology to realize the integration of microelectronics and machinery. Broadly speaking, MEMS refers to micro-electro-mechanical systems that integrate micro-sensors, micro-actuators, signal processing and control circuits, interface circuits, communication systems, and power supplies. MEMS technology is a typical multidisciplinary frontier research field.
The development of MEMS has opened up a whole new technology field and industry. It not only can reduce the cost of electromechanical systems, but also can accomplish tasks that many large-scale electromechanical systems cannot accomplish. In aviation, aerospace, automotive, biomedical, environmental monitoring, military, and almost all areas of contact with people have a very broad application prospects. At the same time, MEMS systems can also be used for medical treatment, high-density storage and display, spectral analysis, information acquisition, and the like.
The growth rate of MEMS technology and its products is very fast, and it is in a period of technological development. In a few years, it will usher in a period of rapid development of the MEMS industry. In 2000, the market for MEMS in the world has reached 120 to 14 billion U.S. dollars, and the related market brought by it will reach 100 billion U.S. dollars.
2. Biochips with biochip microelectronics and biotechnology are closely linked. Bioengineering chips represented by DNA chips will be another hotspot and new economic growth point in the 21st century microelectronics field.
With microelectronic processing technology, chips containing up to 100,000 to 200,000 DNA gene fragments can be made on fingernail-size silicon wafers. Using this chip can detect or detect genetic changes in a very short period of time. This undoubtedly plays an extremely important role in genetic research, disease diagnosis, disease treatment and prevention, and genetic engineering.
Current biochips mainly refer to microanalysis units and systems constructed on the surface of solid chips through planar microfabrication and supramolecular self-assembly techniques to achieve accurate and rapid determination of compounds, proteins, nucleic acids, cells, and other biological components. , large amount of information screening or testing. The main researches of biochips include the specific implementation technology of biochips, the bioinformatics based on biochips, and the design method of high-density biochips. The processing technology mainly depends on microelectronics processing technology.
Fourth, research and development work and organization of relevant countries and regions in order to seize the commanding heights and initiative of all countries in the world in order to capture microelectronics technology are strengthening scientific research. In order to maintain its advantages in the field of IC design and capture the leading position in the 21st century technology competition, the US SIA organized again in 1997 the revision of the US semiconductor technology development blueprint. In the same year, the U.S. government and industry also cooperated to set up a new joint company, the Advanced Microelectronics Research Corporation (MARCO), based on U.S. universities, focusing on strengthening research and development of technologies that may occur in the 8-10 years. The Department of Defense of the United States supports the requirements for special products for military and space applications, supports the joint development of the industry, and lists microelectronics technology as a key national defense technology project.
In order to change the declining semiconductor competitiveness and meet the 21st century competition, Japan has in recent years strengthened the development and production of ASICs and MPUs. In particular, the rapid development of SOC has caused great concern to Japanese companies and began to invest in this area. The "Ultra-Advanced Electronic Technology" development plan, which began in early 1996, is a common research and development plan for 21st century production and government officials. It will mainly develop basic technologies in three areas, including semiconductor devices, magnetic storage and display devices, from 2005 to 2010. To implement this plan, the Ministry of International Trade and Industry organized the Joint Research Organization (ASET). In order to develop large wafer technology, the "Super Silicon Institute" (SSI) was jointly established in 1996 to jointly research and develop key technologies for 400mm silicon wafers. In addition, Japan is implementing a ten-year, $250 million "micro-electronic mechanical system plan" for the technological advantage in the field of microelectronics machinery technology.
In order to revitalize and develop IC technology, Europe has proposed the European Microelectronics Application Development Plan (MEDEA) for short-term completion of the JESST program. In March 1997, the European Union also proposed a research project named European Advanced CMOS (ACE), which is a deep sub-meter technology research and development plan coordinated by the Inter-school Microelectronics Research Center (IMEC) of Belgium. The goal is to develop 0.13 micron. -0.10 micron technology.
In the 1990s, South Korea's IC industry has achieved rapid development and the level of its technology has improved significantly, especially in the semiconductor memory technology field. It has become a powerful Japanese competitor. In order to ensure the realization of 16G DRAM-level semiconductor manufacturing technology for the 21st century and Korean semiconductor's position in the international market, the Korean government decided to implement a new semiconductor promotion program from 1998 to 2006, mainly to research nanotechnology and system chips, and to develop and manufacture. 0.1 micron, Gigabit or higher semiconductor core technology and cutting-edge equipment.
In China's Taiwan region, the semiconductor industry entered a period of rapid development in the 1990s, and its industrial average annual growth rate was as high as 32% between 1991 and 1997. In order to achieve the goal of becoming a semiconductor manufacturing center in the world and the main chip supply destination in the world, and to meet the technological competition in the 21st century, the Taiwan region is strengthening investment, developing a chip manufacturing industry centered on Foundry, and strengthening the establishment of strategies with related companies worldwide. alliance. At the same time, it invested 260 million U.S. dollars in the construction of a nanoelectronic device laboratory at Taiwan Jiaotong University. Its main task is to study new areas below 0.1 microns, and it is required to double the number of places for training doctoral and master students.
21 The research work on the three important directions in the development of silicon microelectronics in the world has just started in the international community. Breakthroughs for it are a stimulus for scientists, and they motivate us to work hard and fight for the peak. It is a rare opportunity for a country. Once this major opportunity is seized, it may prompt The leap in microelectronics technology in China has shortened and caught up with the international advanced level and achieved success later. Otherwise, once the opportunity is missed, it will undoubtedly widen the gap and be at a disadvantage in the international competition.
The Siemens Logistics and Assembly Systems Division has synchronized its latest MicrobeamTM and modular SIPLACE systems globally into China. Tilo Brandis, chairman of the Siemens Logistics and Assembly Electronics Assembly Systems Division, said that China will one day become our production base because it is not only China’s huge market demand that attracts us. China’s high-quality engineers are also what we in Germany need, but we will never We will not reduce the quality of our products by relocating our production bases. According to Tilo Brandis, the company has established a world-leading electronic manufacturing demonstration factory in Shenzhen to demonstrate to the industry the optimization of its SIPLACE complete solution.
Assembleon also believes that China is not only a low-cost manufacturing base, but also one of the key drivers of the global market and technology. According to Corinthian CEO Cor Scholten, in the mobile phone market, color screens and photo-taking have actually become the standard configuration of the Chinese market, but this is not the case in other countries. All of these put forward higher requirements for SMT process technology and equipment. For this purpose, Assembleon has planned to transfer the manufacturing of some of its AX series modular mounters to China. Global Instruments, one step ahead, claimed that by the end of 2005, 50% of Global Instruments's placement machines were produced in China, and that 100% of local manufacturing was based on the current 70% local matching rate.
In 2004, the world’s most advanced manufacturing equipment for the growth of China’s three largest electronics manufacturers entered China, objectively indicating that Chinese electronics manufacturers are producing advanced products. Lule, president of NEC Communications (China) Co., Ltd., stated at the 3G mobile phone development forum held in Shenzhen in October 2004 that “it is not enough to have a single advantage in the upcoming 3G market in China. NEC’s 3G business focuses on China. In addition to the supply of the Japanese market, all NEC's 3G handsets are manufactured in China, and 1/3 to 2/3 of the technology R&D will be moved to China.â€
Su Mingcun, general manager of Shanghai and North China operations of Flextronics, an SMT equipment purchaser, repeatedly emphasized that Flextronics has extended the traditional EMS service in China and has provided customers with end-to-end service capabilities, including innovative product design. , test programs, production, IT expertise, and logistics, logistics, warranty services, etc.
The momentum of in-depth development of China's domestic electronics suppliers to the industry is even more encouraging. Changhong, which has succeeded in the success of China's color TV industry in occupying the domestic market, has not only produced large-scale digital devices, but has also been adopted by international companies such as Toshiba, NEC, Samsung, and LG. There are 20 wholly owned and controlled electronics companies under the Daxian Group, but 50% of them are supporting companies. After the Founder Group acquired Zhuhai multilayer circuit board company in September 2003, it is currently preparing to further infiltrate into the chip manufacturing industry through joint ventures.
At the International Electronic Products and Parts Sourcing Fair held in Shanghai in April 2004, Hamilton Shack, vice president of global procurement for Radio Shack, the largest mobile phone seller in the United States, stated: “At present, if a company does not purchase products from China, it is fundamental. Can not meet the needs of consumers." It is reported that Radio Shack's goal is to hope that in 2004 China's purchases accounted for 75% of its global purchases. It can be seen that the products of China's electronics manufacturers are completely recognized by the world's demand markets, and they are not only cheap but also beautiful.
The miniaturization of production and the lead-free production of products have become opportunities for China's electronics manufacturing technology advancement in multilayer boards, flexible boards, and high-density interconnect (HDI/BUM) substrates and IC packaging board substrates (BGA, CSP). Today is becoming a mainstream demand, 76% of China's electronics manufacturing army is the reality of foreigners. Is there any reason to despise China's electronics manufacturing? Sammy Yi, deputy director of the SMTA International Committee, said in the first half of 2004: “In China, companies engaged in direct electronic manufacturing, or suppliers of materials and equipment, are still using traditional low-tech and low-cost technologies to locate companies in China. I am afraid that the direction of development will not be able to keep up with the situation."
The development and progress of microelectronics technology is mainly based on the continuous improvement of process technology, which makes the feature size of devices continue to shrink, resulting in continuous increase in the degree of integration, reduced power consumption, and improved device performance. In the 21st century, microelectronics technology will continue to be dominated by silicon-based CMOS process technology, which is continuously shrinking in size. Although microelectronics has made great progress in the research of compound semiconductors and other new materials and its application in some fields, it is still far from the conditions for replacing silicon-based processes. With the development of silicon integrated circuit technology, trillions of dollars in equipment and technology investment worldwide have enabled silicon-based processes to form very strong industrial capabilities. At the same time, long-term research investment has enabled people to understand the various properties of silicon and its derivatives to a very deep, very thorough and become the most natural elements of more than 100 kinds, which is a very valuable accumulation of knowledge.
The main development aspects of silicon-based microelectronics technology are threefold:
First, continue to reduce the feature size of the device The so-called feature size refers to the minimum line width in the device for MOS devices, usually refers to the device GeGe determined by the communication geometry, is a processing line in the smallest size can be processed, but also in the design The minimum design size unit (design rule) used is often used as a sign of technical level.
Based on market competition, continuously improving product performance/price ratio is the driving force for the development of microelectronics technology. Reducing feature size to increase integration is one of the most effective means of improving product performance/price ratio. Only the feature size is reduced. Under the same integration level, the chip area can be made smaller, and the wafer output of the same diameter can be improved. Of course, adding the diameter of the silicon wafer can also increase the output, and the increase in integration can not only increase the output, but also increase the speed and reliability of the product, and accordingly the cost can be reduced.
Based on the above reasons, under the impetus of new technology, integrated circuits have increased their integrated level by 4 times every three years since the invention of the integrated circuit in the 40 years since its invention, while the processing feature size has been reduced by 2 times. This is Gordon E, one of the founders of Intel Corporation. The law that Dr. Moore summed up in 1965 was called Moore's Law.
Integrated circuit technology is the fastest-growing technology in the last 50 years, and the design rules for the most important feature parameters of integrated circuits have shrunk by 140 times in 40 years from 1959. The average transistor price is reduced by 107 times.
Table 2 shows the characteristics of semiconductor technology processing dimensions observed by organizations such as STA in the United States in 1999 and the development milestones of the corresponding representative products. According to its forecast, 4G DRAM will begin to enter production in 2003. Its degree of integration reaches 4 billion components, which is equivalent to the volume of newspapers (19,000 pages) that can be stored for one and a half years or 47 minutes of animation or 6 hours of speech.
The wafer diameter of large-scale production is mainly 200mm, but 300mm-diameter silicon wafers began to appear around 2000. 20 Around the year of 15 or so there may be 400-450mm diameter silicon wafers.
However, it should be pointed out that the development history and technological progress pointed out by this odometer do not mean that one generation will be eliminated. On the contrary, the actual industry distribution tends to coexist for several generations, occupying the relevant application fields with the lowest cost and the largest income/input ratio.
As device feature sizes shrink, we face two levels of problems: the level of key technology development and the level of basic research.
1. The key technology development level has now entered large-scale production at 0.25 micron and 0.18 micron. The 0.15-micron and 0.13-micron large-scale production technologies have also been developed and have the conditions for large-scale production. Of course there are still a lot of development and research work to be done, such as the development of IP modules, the development of device models for EDA services, and product development based on the above-mentioned processing technologies. However, in the 0.13 micron - 0.07 micron phase, the most critical processing technology - exposure technology is still a big problem, has not yet been resolved. We know that the reason why the device feature size can be reduced is mainly due to the progress of exposure technology. As can be seen from the figure, there is a "gap" to be developed around 0.1 microns. Whoever can make a breakthrough in this "gap" will have an advantage in the development of the IC industry five years later. Also below 65nm is using E? V (Extra? V) is still using electron beam stepper or other methods, are still under study.
In another key technology - interconnect technology, copper interconnects have been used in the 0.25--0.18 micron technology generation, but after 0.13 micron, the reliability of copper interconnects and low dielectric constant insulation materials used together Still to be studied. Similarly, anyone who can make a breakthrough can seize the initiative.
2. The basic research level is mainly after 0.07 micrometers, especially for new devices with spatial dimensions on the order of nanometers (10-9m) and time scales of femtosecond (1015s), which will encounter device structures, key processes, and integration technologies. A series of problems in heat dissipation problems, material systems, and theoretical foundations. Specific areas that require innovation and focus development include transport theory, device models, thermal barrier models, simulation and simulation software for sub 50 nm semiconductor devices based on mesoscopic and quantum physics, novel device structures, and high-K gate dielectric materials. New gate structures, electron beam step lithography and 13nm EUV lithography, ultra-fine line etch, low-k dielectrics and Cu interconnects, integration technologies, and thermal technologies.
Second, the system integration chip (SOC) is the focus of development;
At the beginning of the development of integrated circuits (ICs), circuits began with the physical layout of the device, and later appeared the Cell-Lib, using IC design from the device level to the logic level. This design idea makes a large number of circuits and Logic designers can directly participate in IC design, which greatly promotes the development of the IC industry. However, the IC is not the final product. It can only be used if it is loaded into a complete system. The IC realizes the entire system by means of printed circuit board (PCB) technology. Although the speed of ICs can be very high and the power consumption can be very small, the performance of the entire system is greatly limited due to the delay of the connection between the ICs in the PCB board, the reliability of the PCB board, and the weight limitations. With the development of high-speed, low-power, low-voltage and multi-media, network, and mobile systems, the requirements of the system for the circuit are getting higher and higher, and the traditional IC design technology can no longer meet the requirements of the entire system with increasingly higher performance. . At the same time, as the level of IC design and process technology continues to increase, the scale of integrated circuits is getting larger and larger, and the complexity is getting higher and higher, and the entire system can already be integrated into one chip. Currently, 108-109 transistors can be integrated on one chip, and with the development of integrated circuit manufacturing technology, the 21st century microelectronic technology will gradually develop from the current 3G (G=109) era to 3T (T=1012). In the era, the storage capacity developed from G-bit to T-bit, the speed of IC devices evolved from GHz to THz, and the data transmission rate ranged from Gbps to Tbps.
It is in the dual role of demand pulling and technology promotion that the system-on-chip (SOC) concept in which the entire system is integrated on an IC chip has emerged.
The design principles of SOC and IC are different. It is a revolution in the field of microelectronics design.
From the perspective of the entire system, the SOC integrates processing mechanisms, model algorithms, software (especially the operating system on the chip - embedded operating systems), chip architecture, and the design of circuits at each level up to the device, in a single chip. Complete the function of the entire system. Its design must start from the system behavior level Top-Down. Many studies have shown that compared with systems composed of ICs, SOC designs can comprehensively and comprehensively consider various situations of the entire system, and can achieve higher-performance system metrics under the same technological conditions.
SOC mainly has three key support technologies: 1Software and hardware collaborative design technology. Functional Partition Theory for Software and Hardware for Different Systems. The closer integration of hardware and software is not only an important feature of SOC, but also a major trend in the development of IT industry in the 21st century. 2IP module library problem. There are three types of IP modules, namely soft cores, which are mainly functional descriptions; solid cores, which are mainly structural designs; and hard cores, process-based physical designs, process-related, and process-proven. Among them, the use of hard cores has the highest value. CMOS CPUs, DRAMs, SRAMs, E2PROMs, and flash memory, as well as A/D, D/A, etc., can all become hard cores, especially based on deep sub-micron device models and circuit simulations, on speed and power consumption. The modules that are optimized and have the greatest process tolerance are most valuable. 3 comprehensive analysis technology between module interfaces. This mainly includes the glue logic tec hnologies between IP modules and the comprehensive analysis and implementation technology of IP modules.
The transformation of microelectronics technology from IC to SOC is not only a conceptual breakthrough, but also an inevitable result of the development of information technology. Through the above three support technology innovations, it will inevitably lead to another information technology revolution featuring system chips. . At present, SOC technology has emerged, and the 21st century will be a period of rapid development of SOC technology.
Third, the combination of microelectronics and other disciplines gave birth to new technologies and industrial growth point The strong vitality of microelectronics technology is that it can produce microelectronic structural modules with high reliability and high precision in low cost and in large quantities. Once this technology is combined with other disciplines, it will create a series of new disciplines and major economic growth points. As a typical example of successful integration with microelectronics technologies, MEMS (micro-electro-mechanical system or micro-electromechanical system) technology and bio-chips are included. The former is a combination of microelectronics technology and machinery, optics and other fields, the latter is a product of bioengineering technology.
1. MEMS technology The microelectronic mechanical system is a broadening and extension of microelectronics technology. It integrates microelectronics technology and precision machining technology to realize the integration of microelectronics and machinery. Broadly speaking, MEMS refers to micro-electro-mechanical systems that integrate micro-sensors, micro-actuators, signal processing and control circuits, interface circuits, communication systems, and power supplies. MEMS technology is a typical multidisciplinary frontier research field.
The development of MEMS has opened up a whole new technology field and industry. It not only can reduce the cost of electromechanical systems, but also can accomplish tasks that many large-scale electromechanical systems cannot accomplish. In aviation, aerospace, automotive, biomedical, environmental monitoring, military, and almost all areas of contact with people have a very broad application prospects. At the same time, MEMS systems can also be used for medical treatment, high-density storage and display, spectral analysis, information acquisition, and the like.
The growth rate of MEMS technology and its products is very fast, and it is in a period of technological development. In a few years, it will usher in a period of rapid development of the MEMS industry. In 2000, the market for MEMS in the world has reached 120 to 14 billion U.S. dollars, and the related market brought by it will reach 100 billion U.S. dollars.
2. Biochips with biochip microelectronics and biotechnology are closely linked. Bioengineering chips represented by DNA chips will be another hotspot and new economic growth point in the 21st century microelectronics field.
With microelectronic processing technology, chips containing up to 100,000 to 200,000 DNA gene fragments can be made on fingernail-size silicon wafers. Using this chip can detect or detect genetic changes in a very short period of time. This undoubtedly plays an extremely important role in genetic research, disease diagnosis, disease treatment and prevention, and genetic engineering.
Current biochips mainly refer to microanalysis units and systems constructed on the surface of solid chips through planar microfabrication and supramolecular self-assembly techniques to achieve accurate and rapid determination of compounds, proteins, nucleic acids, cells, and other biological components. , large amount of information screening or testing. The main researches of biochips include the specific implementation technology of biochips, the bioinformatics based on biochips, and the design method of high-density biochips. The processing technology mainly depends on microelectronics processing technology.
Fourth, research and development work and organization of relevant countries and regions in order to seize the commanding heights and initiative of all countries in the world in order to capture microelectronics technology are strengthening scientific research. In order to maintain its advantages in the field of IC design and capture the leading position in the 21st century technology competition, the US SIA organized again in 1997 the revision of the US semiconductor technology development blueprint. In the same year, the U.S. government and industry also cooperated to set up a new joint company, the Advanced Microelectronics Research Corporation (MARCO), based on U.S. universities, focusing on strengthening research and development of technologies that may occur in the 8-10 years. The Department of Defense of the United States supports the requirements for special products for military and space applications, supports the joint development of the industry, and lists microelectronics technology as a key national defense technology project.
In order to change the declining semiconductor competitiveness and meet the 21st century competition, Japan has in recent years strengthened the development and production of ASICs and MPUs. In particular, the rapid development of SOC has caused great concern to Japanese companies and began to invest in this area. The "Ultra-Advanced Electronic Technology" development plan, which began in early 1996, is a common research and development plan for 21st century production and government officials. It will mainly develop basic technologies in three areas, including semiconductor devices, magnetic storage and display devices, from 2005 to 2010. To implement this plan, the Ministry of International Trade and Industry organized the Joint Research Organization (ASET). In order to develop large wafer technology, the "Super Silicon Institute" (SSI) was jointly established in 1996 to jointly research and develop key technologies for 400mm silicon wafers. In addition, Japan is implementing a ten-year, $250 million "micro-electronic mechanical system plan" for the technological advantage in the field of microelectronics machinery technology.
In order to revitalize and develop IC technology, Europe has proposed the European Microelectronics Application Development Plan (MEDEA) for short-term completion of the JESST program. In March 1997, the European Union also proposed a research project named European Advanced CMOS (ACE), which is a deep sub-meter technology research and development plan coordinated by the Inter-school Microelectronics Research Center (IMEC) of Belgium. The goal is to develop 0.13 micron. -0.10 micron technology.
In the 1990s, South Korea's IC industry has achieved rapid development and the level of its technology has improved significantly, especially in the semiconductor memory technology field. It has become a powerful Japanese competitor. In order to ensure the realization of 16G DRAM-level semiconductor manufacturing technology for the 21st century and Korean semiconductor's position in the international market, the Korean government decided to implement a new semiconductor promotion program from 1998 to 2006, mainly to research nanotechnology and system chips, and to develop and manufacture. 0.1 micron, Gigabit or higher semiconductor core technology and cutting-edge equipment.
In China's Taiwan region, the semiconductor industry entered a period of rapid development in the 1990s, and its industrial average annual growth rate was as high as 32% between 1991 and 1997. In order to achieve the goal of becoming a semiconductor manufacturing center in the world and the main chip supply destination in the world, and to meet the technological competition in the 21st century, the Taiwan region is strengthening investment, developing a chip manufacturing industry centered on Foundry, and strengthening the establishment of strategies with related companies worldwide. alliance. At the same time, it invested 260 million U.S. dollars in the construction of a nanoelectronic device laboratory at Taiwan Jiaotong University. Its main task is to study new areas below 0.1 microns, and it is required to double the number of places for training doctoral and master students.
21 The research work on the three important directions in the development of silicon microelectronics in the world has just started in the international community. Breakthroughs for it are a stimulus for scientists, and they motivate us to work hard and fight for the peak. It is a rare opportunity for a country. Once this major opportunity is seized, it may prompt The leap in microelectronics technology in China has shortened and caught up with the international advanced level and achieved success later. Otherwise, once the opportunity is missed, it will undoubtedly widen the gap and be at a disadvantage in the international competition.