New RTP provides thermal protection for reflow soldering

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TE Connectivity's TE Circuit Protection division announced: Release a rated current (AC) and the rated current (DC) having a temperature of 140 ° C OFF (topen) reflowable thermal protection (RTP) device . Innovative RTP devices enable fast and easy installation using industry-standard component placement and lead-free reflow soldering equipment, ensuring that manufacturers transition from manual assembly to surface mount device (SMD) processes to achieve significant lower costs. The new RTP 140R060S (AC) and RTP140R060SD (DC) devices offer designers a more convenient, cost-effective alternative to thermal fuses that protect low temperature AC or DC applications from potential thermal events. damage.

The RTP140R060S device for rated AC applications features series resistance of only 0.7mOhm (typ), high voltage capability (250VAC), and high current AC interrupt rating (80A at 120V AC). The device helps protect against damage from over-temperature events in low-temperature AC industrial applications such as lighting dimmers. Because the dimmer is embedded in the wall, it can be difficult to release heat, resulting in a thermal event. In addition, MOSFETs used in this type of design fail into the resistive mode and generate heat resulting in a thermal runaway event. To meet the space and heat challenges, the RTP140R060S device can be mounted on a PCB near the MOSFET it protects.

The RTP140R060SD for rated DC applications helps protect MOSFETs from thermal event damage in low-power DC applications such as power tools, electronic monitoring and automotive electronics. Similar to devices rated for AC applications, the RTP140R060SD device provides a series resistance of only 0.7mOhm (typ) with an open circuit temperature of 140°C to help prevent false triggering. In addition, the device's high voltage capability (32VDC) and high current DC interrupt rating (200A at 16V DC) make it particularly suitable for providing robust thermal protection in DC applications where high levels of protection must be guaranteed Reliability and security.

TE Circuit Protection 's RTP technology uses a one-time electronic activation program that makes it thermally sensitive, allowing disconnection at 140 °C in the application field. Prior to activation, an RTP device was able to withstand three lead-free solder reflow steps (up to a peak of 260 ° C) without breaking. Activation can be implemented in the system test or in the actual application site.

Unlike radial lead thermal fuses that must be installed after reflow soldering, RTP devices allow the use of standard surface mount manufacturing methods, eliminating the need for special assembly procedures. The device can also be mounted on a dual-panel PCB.

"The new low temperature AC/DC rated RTP device is a very important extension of our RTP portfolio," said Faraz Hasan, Global Marketing and Business Development Manager, Electrical/Industrial/Lighting Products, TE Circuit Protection , "New Devices and Existing The RTP200 device has the same shape, but its activation temperature is lower."

This RTP device is lead-free and halogen-free, RoHS compliant and supports conformal coatings. UL testing is currently underway.