There is no suspense. At the 75th Plenary Session of the 3GPP, the 5G acceleration proposal was passed.
The large-scale deployment of 5G was advanced six months ahead of schedule. This is the time for the new proposal to come out, not long, but enough to change the plan of many people.
Looking back over the past 30 years, each generation of standards has been updated, mostly in a 10-year cycle, but its industrialization rhythm is actually getting faster and faster.
The commercial time of the world's first analog network was in 1979; the first GSM network was commercial in 1992; the first 3G network was commercial in 2001; the first 4G network was commercial in 2009.
Starting from 2G, the time difference between each generation of technology and commercial scale is 13 years, 9 years, and 8 years.
Now, the commercial deployment of the first 5G network will not be later than 2018.
For example, South Korea's KT has planned to launch the 5G-based ultra-high-definition remote real-time live broadcast service at the PyeongChang Winter Olympics in 2018.
In fact, the distance between 4G and 5G is not as far away as most people think.
In actual commercial deployments, each generation of technological changes is often split into multiple phases, step by step in a smoother upgrade.
The reason is that for a heavy asset industry with a construction cost of hundreds of billions, fixed asset protection is always one of the most important considerations.
Although each generation of communication technology has a revolutionary performance improvement, from the technical point of view, most of them are the evolution from qualitative change to quantitative change, and there are few subversive changes that appear out of thin air.
This is true from 2G to 3G, from 3G to 4G, and even from 4G to 5G.
Compared with 4G, none of the 5G candidate technologies are truly revolutionary technologies.
Whether based on frequency domain, time domain or spatial domain, whether it is a large-scale base station based on vector processing or the development of high-frequency millimeter waves, they are still essentially extensions, upgrades and combinations of known technologies.
Most importantly, many of these technologies can be deployed in 4G networks in advance and continue to be extended after the air interface standard is upgraded to 5G.
For example, Massive MIMO (large-scale antenna array).
This technology increases the number of antenna ports from no more than eight to more than 100, and introduces signals into the complex domain for large-scale precoding, thereby achieving a significant increase in spectral efficiency.
In June 2016, Softbank and ZTE have verified the ultimate performance of Massive MIMO in a real-world commercial environment.
In experiments conducted at four locations in the Tokyo metropolitan area, Massive MIMO enabled the LTE network to achieve an average speed increase of approximately 6.7 times, with a single cell peak throughput of 316 Mbps; simultaneous access to 200 UEs for different services: for weak signal regions at the cell edge It has achieved 8~10 times more Internet experience than traditional macro stations.
In addition, MUSA (multi-user shared access), UDN (ultra-dense network), RAN virtualization and other technologies are also 5G technologies that can be deployed in 4G networks in advance.
The significance of the 5G acceleration proposalThe proposal is clear, and the non-independent 5G air interface standard will be completed in December 2017.
This standard defines the existing LTE and 5G convergence networking mode, and provides a higher rate by means of dual connectivity between LTE and 5G wireless systems, so that existing LTE operators can quickly realize 5G operation and deployment; After the independent 5G air interface standard is completed, the 5G independent networking can be used.
So, this is the 5G outpost.
Prior to this, the industry generally believed that 2020 is the first year of 5G commercial use, why now need to speed up?
Obviously, with the outbreak of mobile broadband services, the exhausted 4G network has been difficult to support the scheduled time nodes, and the transition technology to 5G has naturally become the trend of the industry.
Although large-scale commercial use around the world will take time, both the operators and equipment companies, the preemptive demonstration of the enclosure effect, will help to suppress competitors in the subsequent competition stage.
Therefore, we see that the list of supporting 5G acceleration proposals, from AT&T, NTTDocomo, KT, Vodafone, Deutsche Telekom and other well-known operators, to Huawei, ZTE, Ericsson, Qualcomm, Intel and other core industry chain giants, all hope Promote commercial advancement of 5G.
2.54mm (.100") Pin Headers
Antenk`s line of 2.54mm pitch pin headers are durably made for high vibration environments, for board-to-board or PCB to PCB Connectors, with industry-leading current of 3.0A. Designed for low-profile applications, this pin header is made from high-temperature thermoplastic and is offered with several means of connections and mounting styles such as through-hole (THM) or surface mount (SMT) and can be in vertical (straight), elevated or at a right angle configuration/orientation
Pin header customization is also available upon your request. The 2.54mm pitch pin header is highly recommendable for signal and low power PC board connections when space is at a premium and when 1.0mm and 1.27mm pitch headers cannot dissipate the required current. In addition, the 2.54mm pitch pin header holds an excellent mating quality that fits with various types of female connectors.
Applications of 2.54mm Pitch Pin Headers
Motherboard Connectors
The Motherboard of a computer holds together many of the crucial components such as the central processing unit (CPU), memory and connectors for input and output devices.
Printer Connectors
Automotive PC Connectors
Smart, high power automotive PC power supply garners its capabilities from quality pin headers, designed for general purpose battery powered applications. These are manufactured to provide power and to control the motherboards' switch based on ignition status.
Battery Connections
Rechargeable battery packs, battery balancers, battery eliminator circuits. Battery connections rely on the ability of the current to pass reliable and solid current. This prevents overheating in the circuit and voltage drop.
Medical Diagnostic and Monitoring equipment
Communications: Telecoms and Datacoms
Industrial and Automotive Control and Test
Mount Type: Through-hole vs Surface Mount
2.54mm pitch pin (male) headers are offered in either Surface-mount or Through-hole mount termination. At one side of this pin header is a series of pins which can either be mounted and soldered directly onto the surface of the PCB (SMT) or placed into drilled holes on the PCB (THM).
Through-Hole (Poke-In)
Best used for high-reliability products that require stronger connections between layers.
Aerospace and military products are most likely to require this type of mounting as these products experience extreme accelerations, collisions, or high temperatures.
Useful in test and prototyping applications that sometimes require manual adjustments and replacements.
2.54mm vertical single row header, 2.54mm vertical dual row header, 2.54mm Elevated single row pin header, 2.54mm Elevated dual row pin Header, 2.54mm Right-angle single row header and 2.54mm Right-angle dual row header are some examples of Antenk products with through-hole mount type.
Surface-Mount
The most common electronic hardware requirements are SMT.
Essential in PCB design and manufacturing, having improved the quality and performance of PCBs overall.
Cost of processing and handling is reduced.
SMT components can be mounted on both side of the board.
Ability to fit a high number of small components on a PCB has allowed for much denser, higher performing, and smaller PCBs.
2.54mm Right-angle Dual Row pin header, 2.54mm SMT Single row pin header, 2.54mm SMT Dual row pin header and 2.54mm Elevated Dual Row Pin Header are Antenk`s SMT pin headers.
Soldering Temperature for 2.54mm Pitch Pin Headers
Soldering SMT pin connectors can be done at a maximum peak temperature of 260°C for maximum 60 seconds.
Pin-Type: Vertical (Straight) and Right-Angle
2.54mm pitch headers may be further classified into pin orientation as well, such as vertical or straight male header or right-angle male header.
One side of the series of pins is connected to PCB board in which the pins can be at a right-angle to the PCB surface (usually called "straight" or [vertical") or.
Right-Angle Pin (Male) Header Orientation
Parallel to the board's surface (referred to as "right-angle" pins).
Each of these pin-types have different applications that fit with their specific configuration.
PCB Connector Stacking
Elevated Pin Header Orientation
Elevated pins aka Stacked Pins or Mezzanine are simply stacked pin headers providing an exact distance requirement between PCBs that optimizes electrical reliability and performance between PCB boards.
This type of configuration is the most common way of connecting board-to-board by a connector. First, the stacking height is calculated from one board to another and measured from the printed circuit board face to its highest insulator point above the PCB.
Single, Dual or Multiple Number of Rows
For a 1.0mm straight or vertical male pin header, the standard number of rows that Antenk offers ranges from 1 to 2 rows. However, customization can be available if 3, 4 or n number of rows is needed by the customer. Also, the number of contacts for the single row is about 2-40 pins while for dual row, the number contacts may vary from 2-80 pins.
Pin Material
The pins of the connector have been designed with copper alloy. With customer`s demand the pins can be made gold plated.
Breakaway design
The pin headers are also equipped with a breakaway design making them fully compatible with their female receptacles.
Custom 2.54mm Pitch Pin Headers
Customizable 2.54 mm pitch pin headers are also available, making your manufacturing process way faster as the pins are already inserted in the headers, insulator height is made at the right size and the accurate pin length you require is followed.
Parts are made using semi-automated manufacturing processes that ensure both precision and delicacy in handling the headers before packaging on tape and reel.
Tape and Reel Packaging for SMT Components
Antenk's SMT headers are offered with customizable mating pin lengths, in which each series has multiple number of of circuits, summing up to a thousand individual part number combinations per connector series.
The tape and reel carrier strip ensures that the headers are packaged within accurately sized cavities for its height, width and depth, securing the headers from the environment and maintaining consistent position during transportation.
Antenk also offer a range of custom Tape and reel carrier strip packaging cavities.
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ShenZhen Antenk Electronics Co,Ltd , http://www.coincellholder.com