Author: Yan of Shanghai Science and Technology Co., Ltd., a research agency
After the long 10 years of turtle development and the first year of the Internet of Things in 2014, especially the strong attack of Qualcomm and NXP in 2014, the rapid development of Internet of Things applications has been promoted, and brought to various industries, especially the electronics industry. The steady growth potential and opportunities of 5 to 10 years, but also brought a series of challenges.
First, IoT devices and applications are not like traditional products. IoT devices and applications put more stringent and extensive requirements on embedded system design. In general, "thing" is sensing, "link" is wireless communication, and "network" is cloud (data and service), so any IoT product is cross-border compared to traditional industries. A high-quality IoT product must have three parts that are of high quality and indispensable. Otherwise, the result is a happy one.
Secondly, for any project engineer and electronic engineer, the technology that requires proficiency in sensing + wireless + cloud is too demanding. Cross-border means that cooperation must be sought. For small and medium-sized project teams, looking for a low school High-end application flexibility Sensing + wireless + cloud ultra-low power embedded development platform is also an easy task. Everyone needs to pay attention to the wide coverage of IoT applications, ranging from a sensing + wireless application to dozens of sensing + multiple wireless gateway applications, as well as complex and variable application environments, as well as low power consumption. The small size of the demanding requirements determines the difficulty of integrating such an embedded development platform.
1. The birth of QFN-1
Since its inception, Runxin Technology has focused on the development of wireless and network technology markets. Rely on the quality RFIC and MCU resources of our first-level distributors (Qualcomm, Skyworks, NXP, Quintic, Synaptics, AMS, AAC, Cellwise). Runxin Technology has also cooperated with many excellent sensor partners for many years (Melexis, Memsvision, Rayway, MuRata, Betterlife, Freescale, Maxim) with high-quality sensor IC resources, together with Runxin Technology's 10 years of focus. The senior R&D team, together with our signed cloud partners (Gizwits, Wechat, JD), will jointly create an ultra-low-power embedded development platform with low, medium and high-end application flexibility, wireless + cloud, its name. It is QFN-1.
2. Who is QFN-1?
QFN-1 is designed by Qualcomm+ Fortune+NXP. The Fortune R&D and Marketing team is responsible for hardware and software implementation and promotion. Gizwits is responsible for providing cloud data support and services, and is committed to providing customers with a simple, easy-to-use, free (third party) IoT embedded development platform for software upgrades and continuous upgrade services.
The goal of QFN-1 is to favor high-end IoT application design. It uses NXP's latest technology dual-core Sensor hub, LPC54102 and Qualcomm's low-power Wifi chip, QCA4002, and embeds Apple's MFI encryption chip. LPC54102 has 100mHz M0+ and 100MHz M4F, M0+ focuses on sensor access and data acquisition, M4F is responsible for system task processing and sensor local algorithm support, embedding wireless driver, cloud driver, encryption and decryption data algorithm and user private protocol, etc. For devices supported by the OS, it is only necessary to connect the LPC54102 to the OS main chip through the SPI. The biggest advantage of this is that it simplifies the difficulty of upgrading the platform.
QFN will have a series of modules, QFN-1 is based on Wifi, and subsequent Runxin Technology will continuously launch modules based on BLE, ZigBee, NFC and RFID; it will also consider the application requirements and design of dual-mode modules and simple gateway modules.
For low-end IoT applications, high-end modules like QFN-1 may not be needed. Runxin Technology also offers single-core QFN-1S modules and a full range of wireless SoC (WIFI, BLE, ZigBee, NFC, RFID, ISMRF, 125KHz Etc) applications and design support.
3. Graphic QFN-1
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