The 12th Summit Forum | Jingtai shares Gong Wen: Localization of small-pitch devices is just around the corner

[High-tech LED reporter | Yue Mengdi] On the afternoon of September 26, in the conference room No. 1 of the C floor of Area B of Guangzhou Pazhou Canton Fair, the 12th High-tech LED Industry Summit Forum hosted by Gaogong LED attracted the presence of the industry.

Gong Wen, general manager of Shenzhen Jingtai Co., Ltd. (hereinafter referred to as “Jingtai Shares”) discussed the theme of “breakthrough of domestically packaged diversified market segments” at the forum and colleagues.


Many people in the industry will see 2014 as the first year of LED lighting. It is also driven by the strong demand for LED lighting that the packaging industry has risen rapidly. The domestic packaging industry is full of orders and the production capacity is released, showing a thriving situation.

According to statistics from the High-tech LED Industry Research Institute (GLII), the output value of the LED midstream packaging industry in the second quarter of 2014 reached 13.84 billion yuan, accounting for 16.88% of the total output value of the LED industry (81.99 billion yuan).

The packaging industry is highly competitive, and the gross profit margin of most domestic packaging manufacturers continues to decline, and the survival of small and medium-sized enterprises is difficult. The first-line packaging manufacturers represented by Ruifeng Optoelectronics and Hongli Optoelectronics have expanded their production capacity and scaled up through mergers and acquisitions.

According to the published semi-annual report of 2014, the net profit of several leading packaging factories such as Guoxing Optoelectronics, Hongli Optoelectronics and Wanrun Technology has increased to varying degrees, in addition to the factors driven by LED lighting, scale effect and production capacity. The improvement of efficiency is also an important factor in the growth of net profit. More importantly, it should be that domestic packaging factories have attached more importance to product quality and brand, and have intensified innovation and research and development.

Due to the “long drive” of international packaging manufacturers such as PHILIPS LUMILEDS, domestic companies are beginning to think more about their competitive advantages. Existing packaging technologies and processes are not enough to support the continued decline in costs and require revolutionary breakthroughs.

In Gong Wen's view, domestic first-line packaging manufacturers still occupy a certain degree of scale advantages, package integration is rapidly increasing, and the technical content of high-end packaging products is increasing, and enterprises need to explore new market segments.

It is also in this context that Jingtai shares started with small-pitch devices to break through the market.

According to data provided by Gong Wen, the indoor small-pitch display will reach a market size of 35 billion by 2017. For the self-confidence of indoor small-spacing domestication, domestic packaging companies have more than 10 years of experience in display device packaging, especially the understanding of display devices, surpassing Taiwanese companies. 80% of the global display manufacturing industry is in China, and 80% of them use domestic packaging devices.

"In the case of billion light, Yiguang entered the small-pitch package earlier and the technology is relatively mature. But the cost and localization service will become its shortcomings." Gong Wen analyzed that localization will bring about a significant cost reduction. After localization, the price of LED devices can be immediately reduced by 30%.

When it comes to the advantages of small-pitch packages, he also frankly said that there are still many problems that need to be solved in LED small-pitch display devices, such as how to maintain module consistency and how to ensure high reliability.

"The second generation of small pitch device products with a comprehensive upgrade of the crystal table, new device structure design, process innovation and surface heat treatment technology can effectively solve these problems." Gong Wen said that with display device products and small pitch device products As technology matures, the share of domestic manufacturers will increase sharply. By then, domestic high-power lighting and small-pitch device packaging products will have a greater impact on the advantages of international packaging manufacturers.

"New materials and semiconductor packaging processes will continue to change the traditional LED package." Gong Wen predicted that due to the close proximity of domestic manufacturers' technology and international manufacturers, the localization cost advantage is increasingly prominent, and the localization of small-pitch devices will be just around the corner.

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