TDK Corporation (President: Kazuhiro Hara) has introduced a wireless power supply coil assembly designed for mobile devices such as smartphones. This receiving coil assembly is specifically tailored for smartphones and achieves an industry-leading thickness of just 0.57mm, making it the thinnest in the market.
Leveraging TDK’s expertise in magnetic material technology and advanced manufacturing processes, this coil uses a unique metal soft magnetic sheet. It not only maintains the advantages of being thin and lightweight but also ensures excellent impact resistance and high reliability. Additionally, TDK has managed to control resistance effectively even at such a minimal thickness. Despite its slim design, the coil meets the efficiency standards required by the WPC Qi certification, making it ideal for integration into modern smartphones. Currently, the output ranges from 0.5A to 0.6A. Looking ahead, TDK plans to develop a thinner version with a thickness of 0.50mm while maintaining the same current output. The product is expected to enter mass production in 2013.
With the growing power demands of smartphones and the increasing need for convenient charging solutions, wireless power standardization has become a key focus. TDK is actively supporting this trend by offering innovative products that combine its magnetic material expertise, precision coil patterning, and magnetic circuit design capabilities.
Moreover, TDK will incorporate its strong background in EMC (Electromagnetic Compatibility) measures to ensure minimal impact on receiving sensitivity. By doing so, TDK aims to provide a comprehensive and efficient wireless charging solution that meets the evolving needs of the market.
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Guangdong Tumtec Communication Technology Co., Ltd , https://www.gdtumtec.com